Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

since 1984

Manufacturer from China
Verified Supplier
1 Years
Home / Products /

IC Bonding Machine

Contact Now
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
Visit Website
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsYang
Contact Now
1 - 6 of 6

 IC Bonding Machine

Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment

High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature ...
Contact Now

Add to Cart

High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for ....
Contact Now

Add to Cart

Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

Supermini Chip Placement Quick Changeover IC Bonder CBD2200 Special use type high precision IC bonder, for a variety of small batch of placement ...
Contact Now

Add to Cart

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; ....
Contact Now

Add to Cart

Sintering Die Bonder SDB 200

Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading Introduction: It is designed for power semiconductor IC bonding market, equipped ...
Contact Now

Add to Cart

IC Bonding Machine

IC Bonding Machine The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new ...
Contact Now

Add to Cart

Inquiry Cart 0