Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
since 1984
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IC Bonding Machine
The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture.
IC bonder is suit able for IC,WLCSP,TSV, SIP,QFN,LGA,BGA process products. Such as optical communication module, camera module, LED, power module, power device, vehicle electronics, 5G RF, memory, MEMS, various sensors, etc.
IC Bonder Machine
