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Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

since 1984

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1 Years
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Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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City:shenzhen
Province/State:guangdong
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Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
  • Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
  • Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Products Detailed
High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature ...
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