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Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

since 1984

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1 Years
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Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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Province/State:guangdong
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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
  • High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
  • High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
Products Detailed
Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; ...
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