Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
since 1984
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Selective Solder Machine Single With Electromagnetic Pump SUNFLOW 3/450
Selective wave soldering is a special form of wave soldering applied to PCB plug-in through-hole soldering. Selective wave soldering generally consists of three modules: flux spraying, preheating, and soldering. The flux nozzle moves to the command position according to the pre programmed program, and selectively spray the position to be welded. After the PCB is preheated by the upper and lower preheating modules, the welding module performs welding according to the programming path.
Selective wave soldering is mainly used in high-end electronic products such as military aerospace, automotive electronics, railway products, switch power supplies, etc. It can meet the through-hole soldering requirements of multi-layer PCBs with high soldering requirements and complex processes.
Features:
Overall diagram:
Soldering process
Basic machine module:
Working Process:After PCB is moved to flux area,the spray head is targeted to the programed position and the flux is applied only to the solder joint to be made. After preheating,the electromagnetic pump moves to the target area and solder joint is made.
Selective soldering system introduction:
Fast and comfortable programing:
Smooth conveying system:
Conveyor System combines chain and roller transports. Chain transport system is chosen in flux and preheating module. The soldering module use the roller transport which performs good in location board and repeatability
High precision spray system:
The standard machine uses a precision drop nozzle with diameter of 130μm, which can evenly spray the flux to the required soldering area. The minimum spray area is 3mm, saving at least 90% flux compared to conventional spray
Perfect preheating system:
Combine stop heater and bottom heater and it sill performs perfectly even for the lead-free soldering or multi-layer boards. Top convection heater has been proved by Sun East Reflow machine for many years and it can offer an even temperature distribution over the complete
board. Bottom IR emitter heater provides optional heating area according the custom board. At the same time, another top heater covers the soldering module and it can maintain the board temperature in all the cycle time.
Stable and high quality soldering system:
Common options:
Product parameters:
| Model | SUNFLOW 3/450 | SUNFLOW 3/610 |
| General Parameters | ||
| Overall dimension(mm) (Not include indicator light and monitor) | 2710(L)*1930(W)*1630(H) | 3040(L)*2240(W)*1630(H) |
| Equipment Weight (kg) | 1550 | 2000 |
| Max PCB size(mm) | 510(L)*450(W) | 610(L)*610(W) |
| Min PCB size(mm) | 120(L)*50(W) | 120(L)*50(W) |
| PCB Top Side Clearance (mm) | 120 | 120 |
| PCB Bottom Side Clearance (mm) | 60 | 60 |
| PCB process edge (mm) | ≥3 | ≥3 |
| Conveyor Height From Floor (mm) | 900±20 | 900±20 |
| PCB Conveying Speed (m/min) | 0.2-10 | 0.2-10 |
| Max/ PCB Weight (kg) | ≤8 | ≤8 |
| PCB Thickness With Jig (mm) | 1-6 | 1-6 |
| Conveyor Width Adjustment Range(mm) | 50-450 | 50-610 |
| Conveyor Width Adjustment Mode | Electric | Electric |
| PCB Conveying Direction | Left to right | Left to right |
| Air Input Pressure (Mpa) | 0.6 | 0.6 |
| Nitrogen Supply | Offered by customer | Offered by customer |
| Nitrogen Input Pressure(Mpa) | 0.6 | 0.6 |
| Nitrogen Consumption (m³/h) | 1.5 | 1.5 |
| Required Purity of Nitrogen(%) | ＞99.999 | ＞99.999 |
| Supply Voltage(VAC) | 380 | 380 |
| Frequency (HZ) | 50/60 | 50/60 |
| Max Power Consumption (kw) | ＜30 | ＜36 |
| Max Current(A) | ＜56 | ＜61 |
| Ambient Temperature (℃) | 10-35 | 10-35 |
| Machine Noise Level (dB) | ＜65 | ＜65 |
| Communication Interface | SMEMA | SMEMA |
| Soldering System | ||
| Max. Soldering distance of X axis (mm) | 510 | 610 |
| Max. Soldering distance of Y axis (mm) | 450 | 610 |
| Max. Soldering distance of Z axis (mm) | 60 | 60 |
| Min outer diameter of nozzle(mm) | 5.5 | 5.5 |
| Nozzle inner diameter (mm) | 2.5-10 | 2.5-10 |
| Max soldering wave height (mm) | 5 | 5 |
| Solder pot capacity (kg) | Approx.13kg(Sn63Pb)/solder pot Approx.12kg(lead-free)/solder pot | Approx.13kg(Sn63Pb)/solder pot Approx.12kg(lead-free)/solder pot |
| Max soldering temperature (℃) | 330 | 330 |
| Soldering heating power (kw) | 1.15 | 1.15 |
| Preheating System | ||
| Preheat temperature range (℃) | ＜200 | ＜200 |
| Heating power (kw) | 17 | 21.5 |
| Heating mode | Hot air+Infrared | Hot air+Infrared |
| Top side preheating | Hot air | Hot air |
| Spraying System | ||
| Max. stroke of X axis (mm) | 510 | 610 |
| Max. stroke of Y axis (mm) | 450 | 610 |
| Spray height(mm) | 60 | 60 |
| Location speed(mm/s) | ＜400 | ＜400 |
| Spray head automatically cleaning | Program control | Program control |
| Flux box capacity (L) | 2 | 2 |
Notices:
1.Power requirements:
①Three phase five wire: voltage 380V, frequency 50/60HZ;
②The wire diameter requirement is 16mm², with a leakage protection switch of 125A and a leakage capacity of 150-200mA.
2.The ground is required to withstand a pressure of 1000kg/m².
3.External ventilation requirements:
①Spray: Duct specification: Ø 150mm exhaust volume 150M³/H;
②Welding: Duct specification: Ø 150mm exhaust volume 150M³/H.